ADFlex Solutions Ltd
Report on solder recycled by solder recovery system
Circuits were soldered using 100% recovered solder in a solder fountain system, representative of the wave solder system and using the same flux. Component analysed was a 30 pin through hole connector.
Visual examination at up to 40x mag. showed that all the solder was smooth, shiny, bright and showed good wetting. No solder splashes or residues were observed.
Examination of microsectioned soldered areas showed there to be good wetting. Compositional analysis of microsectioned solder areas by ZAF analysis gave the following results:
Overall the results obtained indicate the visual solder quality to be acceptable.
INTRODUCTION (2nd Part)
A sample of recovered solder was submitted for compositional analysis by XRF.
Date submitted: 01/07/97
The sample was analysed by XRF against appropriate analytical standards and the results obtained were:
The recovered solder bar shows tin concentration to be consistent with normal production solder.
The initial work above details SEM/ZAF correction analysis of solder joints which show compositional analysis of microsectioned solder areas by ZAF analysis.
Discrepancies between XRF (bulk analysis) and SEM/ZAF (spot analysis) are believed accounted for from the analysis of sectioned samples which are subject to local concentration gradients across grain boundaries after tin migration during solder reflow.